Scientist, Mechanical Engineer (Thermal Analyst) 1 with Security Clearance

L3Harris Technologies
Plano, Texas
May 03, 2024
May 17, 2024
Engineering, Mechanical
Position Type
Analyst, Engineer, Scientist
Full Time
Organization Type
Corporate, Other Corporate
Job Title: Scientist, Mechanical Engineer (Thermal Analyst) (Secret Clearance Required)
Job Code: 580
Job Location: Plano, TX (On-Site)
Job Schedule: 9/80: Employees work 9 out of every 14 days - totaling 80 hours worked - and have every other Friday off. Job Description: This Scientist, Thermal Analyst role will work over a broad range of thermal issues for thermal management of high-power electronics from chip-level simulation to airframe aero-heating analysis. This role is responsible for support of all programs at the L3Harris Plano facility and occasionally assist other facilities. The Agile Development Group (ADG) specializes in developing disruptive, next-generation technologies for advanced Unmanned Air Systems (UAS / UAV), advanced radar systems, next-generation weapon systems, and other RF sensor technologies using small company agility and big company experience. Essential Functions: Thermal modeling of electronic systems and thermal management solutions using FEA, CFD, and analyzes based on first principles.
In cooperation with design engineers, specify thermal management solutions for high power, high heat flux electronic assemblies.
Design / specify heat exchangers.
Design / specify liquid cooled cold walls and thermal planes.
Design/ specify phase change active cooling solutions.
Design thermal test set-ups and execute or oversee testing programs.
Derive thermal conditions for vehicles during a range of flight conditions including the effects of MACH number, angle of attack and altitude.
Primary point-of-contact with various technical customers, suppliers, and sub-contractors on technical matters of custom thermal management solutions.
Support of proposals contributing conceptual thermal designs, costs & performance estimates.
Concisely present results of major analysis in peer reviews
Demonstrate specification compliance to thermal requirements before customers at formal reviews.
Documentation of analysis for historical access.
Review analysis of other engineers & mentor in proper analytic techniques.
Ability to obtain and maintain any additional clearances as required.
Ability to lift to 10 lbs.
Up to 10% travel may be required.
Other duties as required.
Qualifications: Bachelor's Degree and a minimum of 12 years of prior relevant experience. Graduate Degree and a minimum of 10 years of prior related experience. In lieu of a degree, minimum of 16 years of prior related experience.
Active Secret Clearance required.
Minimum 9 years of directly developing thermal solutions for electronics.
Minimum 7 years modeling, specifying, and testing thermal systems and thermal management solutions.
Experience in packaging and cooling of high-power electronics.
Proficient with ANSYS or Ice Pak thermal analysis software.
Clear and concise communication skills; written and verbal.
Extensive knowledge of heat transfer, thermal management, and cooling of electronics.
Successful experience in cooling high power electronic assemblies.
Very familiar with the thermal management of GaAs, GaN, SiGe, and silicon active components.
Experienced using thermal simulation software for transient and steady state analysis.
Experience in thermal testing techniques and instrumentation
Knowledge and direct experience of thermal testing techniques, error analysis, and instrumentation
Understanding and background in fluid distribution networks and flow balancing
Knowledge of and experience with calculation of aerodynamic heating.
Knowledge of and experience with design of RF radome for high heat flux environments.
Knowledge of thermal ablative materials and analytical predicting of useful life.
Able to work in a team environment with design engineers to optimize overall design solutions.
Clear and concise communication of technical principles to peers and non-technical audiences
Experience managing suppliers and sub-contractors of thermal management solutions to schedule and technical performance.
Low-Cycle solder fatigue analysis.
Preferred Additional Skills: Graduate Degree and a minimum of 10 years of prior related mechanical experience.
Experience in design for and testing to military environments (i.e., temperature, vibration, shock, etc.)
Excellent people skills to include collaborating in a multi-disciplinary, diverse, and dynamic team environment.
CAD software experience.
Knowledge of radar systems and high-temperature radome materials.
Knowledge and experience of phase change cooling techniques.
Knowledge and experience with submerged liquid cooling and dielectric cooling fluids.
Mechanical design experience.